The strategic partnership aims to create an advanced AI inference platform targeting the booming demand from global tech giants
Category: Business
South Korean AI semiconductor startup 퓨리오사AI (Puriosa AI) has officially announced a strategic partnership with global semiconductor giant Broadcom on May 28, 2026, to develop next-generation AI accelerators. This collaboration aims to create a high-performance AI inference platform that meets the surging demand from major tech companies worldwide.
AI accelerators are specialized semiconductors engineered for rapid processing of large-scale artificial intelligence computations. The partnership will focus on enhancing 퓨리오사AI's proprietary chip architecture, known as the Tensor Contraction Processor (TCP), into a multi-die chiplet system capable of addressing the needs of hyper-scale AI environments, particularly for large token processing.
The next-generation platform will build upon the commercial success of 퓨리오사AI's second-generation accelerator, called '레니게이드' (RNGD). This AI accelerator is based on TSMC's 5-nanometer process and utilizes SK Hynix's HBM3 memory, currently in mass production as a 180W PCIe-based AI accelerator optimized for large language models (LLMs) and agentic AI workloads.
As part of this initiative, the third-generation AI accelerator will incorporate cutting-edge 2-nanometer compute dies and the next-generation HBM4 and HBM4E memory. Broadcom's advanced packaging technology will enable the integration of multiple silicon dies into a single high-performance chip, enhancing efficiency and performance.
Broadcom's high-speed Ethernet and switch technologies will also be integrated to support rack-level high-bandwidth networking in large AI cluster environments. This comprehensive approach aims to eliminate bottlenecks in data processing, ensuring that AI services can operate seamlessly across massive data centers.
According to industry reports, this partnership is not merely a contract for semiconductor manufacturing but a strategic move to address the growing demand for AI services driven by the rapid expansion of generative AI and agentic AI applications. The collaboration reflects a shift in the AI industry from a focus on learning to one centered on inference capabilities, where power efficiency and operational cost competitiveness are increasingly important.
백준호 (Baek Jun-ho), CEO of 퓨리오사AI, expressed confidence in the partnership, stating, "With Broadcom's infrastructure capabilities combined with our design technology, we can provide a platform for hyper-scale AI services. We have already proven our technological capabilities with our current products, and we aim to achieve industry-leading performance per watt in the next generation of products."
Charlie Kawwas, President of Broadcom's Semiconductor Solutions Group, emphasized that AI inference performance is no longer determined solely by computational speed but also by the efficiency of data communication between servers and racks. He stated, "By combining 퓨리오사AI's semiconductor architecture with our networking technology, we can resolve key bottlenecks in the AI environment."
The sampling of the third-generation AI accelerators is slated to begin in the first half of 2028. The collaboration is expected to significantly impact the AI infrastructure market, particularly as the demand for AI services continues to rise globally.
In addition to this partnership, 퓨리오사AI has secured a total of $250 million (approximately 340 billion won) in cumulative investments and is reportedly pursuing additional funding of $300 million to $500 million ahead of its initial public offering (IPO). This financial backing will support the development and mass production of its next-generation AI chips.
As per Broadcom's financial reports, the company recorded $8.4 billion in AI semiconductor sales for the first quarter of the 2026 fiscal year, marking a remarkable 106% growth compared to the previous year. Broadcom's CEO has indicated that achieving over $100 billion in AI chip sales by 2027 is within reach, highlighting the potential of this rapidly growing sector.
This partnership between 퓨리오사AI and Broadcom signifies a major step forward in the evolution of AI semiconductor technology, positioning both companies to capitalize on the explosive growth of AI applications and infrastructure in the years to come.
As the AI industry continues to evolve, the successful integration of advanced semiconductor technologies will be key to meeting the increasing demands of global tech giants. The first half of 2028 will mark a new chapter in AI computing capabilities with the anticipated launch of the next-generation AI accelerators from this partnership.